OAI MASK ALIGNER MODEL 800
• Precise (1µm-2µm) optical alignment accuracy
• Designed for semiconductor, MEMS front side and backside lithography and nanotechnology applications
• Precision level-to-level mask alignment
• Four-camera optical system for double sided alignment
• Interchangeable mask holders and chucks
• User-defined & controlled substrate-to-mask pressure
• Soft, hard and vacuum contact printing capability
This instrument is housed in IATL 174 and is managed by Schaffer Finney.