OAI MASK ALIGNER MODEL 800

• Precise (1µm-2µm) optical alignment accuracy

• Designed for semiconductor, MEMS front side and backside lithography and nanotechnology applications

• Precision level-to-level mask alignment

• Four-camera optical system for double sided alignment

• Interchangeable mask holders and chucks

• User-defined & controlled substrate-to-mask pressure

• Soft, hard and vacuum contact printing capability

This instrument is housed in IATL 174 and is managed by Schaffer Finney.

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