Oxford Instruments – RIE-ICP PlasmaPro 100 Cobra

• Single wafer cassette loading

• Substrate temperature control is provided by a range of electrodes, with a temperature range of -150°C to +700°C

• 12-line gas pod provides flexibility in processes and process gases

• Cryo Si etch, Bosch deep Si etch and SOI processes for MEMS, microfluidics and photonics

• Up to 200mm single wafer processing

• Available etch and process gases: BCl₃, Cl₂, H₂, Ar, N₂

This instrument is located in IATL 174 and is managed by Schaffer Finney

Reserve equipment on BookIt